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              半導體封裝/ 玻璃用切割砂輪修整板Dressing Plate for Cutting Blades Used in Semiconductor Package or Glass

              • 發布時間:2021-01-01
              • 瀏覽:

              半導體封裝/ 玻璃用切割砂輪修整板Dressing Plate for Cutting Blades Used in Semiconductor Package or Glass(圖1)

              產品介紹 Product info

              半導體封裝用切割砂輪修整板一般為為陶瓷結合劑和樹脂結合劑,磨料為碳化硅或者剛玉,主要用于半導體封裝和玻璃用切割砂輪的整形和開刃。

              The dressing plate, which is for cutting blades used in semiconductor package, mainly consists of ceramic or resin as bond and silicon carbide or corundum as abrasive. It is for truing and dressing the blades, which is used in cutting semiconductor package and glass.

               

              主要特點

              1. 鋒利性高,修整效果好;

              2. 粒度、濃度可控,可選擇性廣;

              3. 規格尺寸和厚度可根據切割砂輪特性定制。

              Main Characteristics

              1.Fine sharpness with good dressing and truing effect.

              2.Controllable granularity and concentration for wide selectivity.

              3.Specification, including size and thickness, could be customized by the characteristics of the cutting blades.

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